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 SPP80N06S2L-06 SPB80N06S2L-06 OptiMOS(R) Power-Transistor
Feature
* N-Channel
Product Summary VDS R DS(on) ID
P- TO263 -3-2
55 6.3 80
P- TO220 -3-1
V m A
* Enhancement mode * Logic Level * 175C operating temperature * Avalanche rated * dv/dt rated
Type SPP80N06S2L-06 SPB80N06S2L-06
Package P- TO220 -3-1 P- TO263 -3-2
Ordering Code Q67060-S6033 Q67060-S6034
Marking 2N06L06 2N06L06
Maximum Ratings, at Tj = 25 C, unless otherwise specified Parameter Symbol Continuous drain current 1)
TC=25C
Value 80 80
Unit A
ID
Pulsed drain current
TC=25C
ID puls EAS EAR dv/dt VGS Ptot T j , Tstg
320 530 25 6 20 250 -55... +175 55/175/56 kV/s V W C mJ
Avalanche energy, single pulse
ID=80 A , V DD=25V, RGS=25
Repetitive avalanche energy, limited by Tjmax 2) Reverse diode dv/dt
IS=80A, VDS=44V, di/dt=200A/s, T jmax=175C
Gate source voltage Power dissipation
TC=25C
Operating and storage temperature IEC climatic category; DIN IEC 68-1
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SPP80N06S2L-06 SPB80N06S2L-06
Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB:
@ min. footprint @ 6 cm2 cooling area
3)
Symbol min. RthJC RthJA RthJA -
Values typ. 0.4 max. 0.6 62 62 40
Unit
K/W
Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Static Characteristics Drain-source breakdown voltage
V GS=0V, ID=1mA
Symbol min. V(BR)DSS VGS(th) IDSS IGSS RDS(on) RDS(on) 55 1.2
Values typ. 1.6 max. 2
Unit
V
Gate threshold voltage, VGS = V DS
ID = 180 A
Zero gate voltage drain current
V DS=55V, VGS=0V, Tj=25C V DS=55V, VGS=0V, Tj=125C
A 0.01 1 1 6.1 4.8 1 100 100 8.4 6.3 nA m
Gate-source leakage current
V GS=20V, VDS=0V
Drain-source on-state resistance
V GS=4.5V, I D=69A
Drain-source on-state resistance
V GS=10V, I D=69A
1Current limited by bondwire ; with an RthJC = 0.6K/W the chip is able to carry ID= 138A at 25C, for detailed information see app.-note ANPS071E available at www.infineon.com/optimos 2Defined by design. Not subject to production test. 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Page 2
2003-05-09
SPP80N06S2L-06 SPB80N06S2L-06
Electrical Characteristics Parameter Dynamic Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time
Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Qgs Qgd Qg
VDD =44V, ID =80A, VGS =0 to 10V VDD =44V, ID =80A
Symbol
Conditions min.
Values typ. 124 3800 890 240 11 21 60 20 max. -
Unit
gfs Ciss Coss Crss td(on) tr td(off) tf
VDS 2*ID *RDS(on)max, ID =80A VGS =0V, VDS =25V, f=1MHz
62 -
S
5050 pF 1180 370 17 32 90 30 ns
VDD =30V, VGS =4.5V, ID =80A, RG =1.6
-
13 38 114 3.5
17 60 150 -
nC
V(plateau) VDD =44V, ID =80A
V
Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge ISM VSD trr Qrr
VGS =0V, IF =80A VR =30V, IF =lS , diF /dt=100A/s
IS
TC=25C
-
0.9 60 92
80 320 1.3 76 115
A
V ns nC
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SPP80N06S2L-06 SPB80N06S2L-06
1 Power dissipation Ptot = f (TC) parameter: VGS 4 V
280
SPP80N06S2L-06
2 Drain current ID = f (T C) parameter: VGS 10 V
90
SPP80N06S2L-06
W A
240 220 200 70 60
P tot
160 140 120 100 80 60 40 20 0 0 20 40 60 80 100 120 140 160 C 190
ID
50 40 30 20 10 0 0 20 40 60 80
180
100 120 140 160 C 190
TC
TC
3 Safe operating area ID = f ( VDS ) parameter : D = 0 , TC = 25 C
10
3 SPP80N06S2L-06
4 Max. transient thermal impedance Z thJC = f (t p) parameter : D = t p/T
10
1 SPP80N06S2L-06
K/W A
/I
D
t = 27.0s p
10
0
V
DS
ID
R
DS (on )
=
10
2
Z thJC
100 s
10
-1
10
1 ms
-2
D = 0.50 0.20 10
-3 1
10
0.10 0.05 0.02
10
-4
single pulse
0.01
10
0
10
-1
10
0
10
1
V
10
2
10
-5
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
VDS
Page 4
tp
2003-05-09
SPP80N06S2L-06 SPB80N06S2L-06
5 Typ. output characteristic ID = f (V DS); T j=25C parameter: tp = 80 s
190
SPP80N06S2L-06
6 Typ. drain-source on resistance RDS(on) = f (I D) parameter: VGS
20
SPP80N06S2L-06
Ptot = 250W
j i
VGS [V] a b 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.5 10.0
A
160 140
e
f
g
h
16
h
c d
R DS(on)
14 12 10 8
i
ID
120
g
e f g h
100 80 60 40 20 0 0 0.5 1 1.5 2 2.5 3 3.5
c a b
fi
j
e
6
j d
4 2 0 5 0 20 40 60 80 100
VGS [V] =
e 3.4 f 3.6 g 3.8 h 4.0 i j 4.5 10.0
4
V
120 A
150
VDS
ID
7 Typ. transfer characteristics ID= f ( V GS ); V DS 2 x ID x RDS(on)max parameter: tp = 80 s
160
8 Typ. forward transconductance g fs = f(I D); T j=25C parameter: g fs
160
A
S
120
120
100
g fs V5 VGS
ID
100
80
80
60
60
40
40
20
20
0 0 0.5 1 1.5 2 2.5 3 3.5 4
0 0 20 40 60 80 100 120 140 160
A 200 ID
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SPP80N06S2L-06 SPB80N06S2L-06
9 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 69 A, VGS = 10 V
21
SPP80N06S2L-06
10 Typ. gate threshold voltage VGS(th) = f (T j) parameter: VGS = VDS
2.4
18 16 14 12 10 8 6 typ 4 2 0 -60 98%
V V GS(th)
R DS(on)
0.9 mA
1.6
180 A
1.2
0.8
0.4
-20
20
60
100
140 C
200
0 -60
-20
20
60
100
C Tj
180
Tj
11 Typ. capacitances C = f (V DS) parameter: VGS=0V, f=1 MHz
10
4
12 Forward character. of reverse diode IF = f (V SD) parameter: T j , tp = 80 s
10
3 SPP80N06S2L-06
Ciss
pF
A
10
2
Coss
10
3
Crss
IF
10
1
C
T j = 25 C typ T j = 175 C typ T j = 25 C (98%) T j = 175 C (98%) 10
2
10 5 10 15 20
0
0
V
30
0
0.4
0.8
1.2
1.6
2
2.4 V
3
V DS
VSD
Page 6
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SPP80N06S2L-06 SPB80N06S2L-06
13 Typ. avalanche energy E AS = f (T j) par.: I D = 80 A , V DD = 25 V, R GS = 25
550
14 Typ. gate charge VGS = f (QGate) parameter: ID = 80 A pulsed
16
SPP80N06S2L-06
mJ
450 400
V
12
E AS
350 300
VGS
10
0,2 VDS max
0,8 VDS max
8 250 200 150 100 2 50 0 25 0 0 20 40 60 80 100 120 140 nC 180 6
4
45
65
85
105
125
145
C 185 Tj
QGate
15 Drain-source breakdown voltage V(BR)DSS = f (Tj) parameter: ID=10 mA
66
SPP80N06S2L-06
V
V(BR)DSS
62
60
58
56
54
52
50 -60
-20
20
60
100
140 C
200
Tj
Page 7
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SPP80N06S2L-06 SPB80N06S2L-06
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Further information Please notice that the part number is BSPP80N06S2L-06 and BSPB80N06S2L-06, for simplicity the device is referred to by the term SPP80N06S2L-06 and SPB80N06S2L-06 throughout this documentation.
Page 8
2003-05-09


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